Advanced Power Electronics Devices and Interface Circuits — Winter 2022

Explain concept of Wide Band Gap (WBG) power semiconductor devices.

Give the comparison of WBG (SiC, GaN) and Si devices.

Explain any half bridge driver IC.

Discuss grounding considerations for driver circuits.

Discuss requirement & importance of isolation.

Explain any half bridge driver IC with SC Protection.

Explain single switch driver IC in detail. (e.g., TLP250)

Explain galvanic isolation.

Explain importance of various protection.

Write short note on hall effect current sensor.

Discuss current transformer.

Explain force to voltage converter.

Explain SCR driver IC (MOC3002) in detail.

List out applications of Logic Analyzer.

Discuss thermal resistance & its Consideration.

Draw and explain block diagram of oscilloscope.

List our various cooing methods.

Explain forced and natural cooing of heat sinks.

Explain heat sink calculations and design in detail.

Explain linear opto-coupler.

Discuss transformer design for driver circuits.

Describe general steps to inductor design for power converters.

Discuss considering of grounding for Power Circuits.

Explain the use of differential voltage probe.

Explain transformer design for “Forward Converter” in detail.